Non-contact wafer transport Bernoulli chuck BC-K series
Transporting 2 to 12-inch wafers laid flat, gently wrapped in air.
The Bernoulli chuck generates a stronger suction force by utilizing Bernoulli's principle to expel air. The transported object makes point contact with the edge of the Bernoulli chuck's surface, allowing it to be transported with stable holding power in a non-contact state at the center of the wafer, without any rotation. The main body is designed to accommodate various wafer sizes with just one unit. 【Features】 - The main body can be selected from three angles of use: 20 degrees, 45 degrees, and 90 degrees. - By changing the guide ring compatible with different inch sizes, it can be used for wafers ranging from 2 to 12 inches. - The use of conductive nylon resin for the main body reduces weight. - There is pattern printing on both sides, accommodating wafers that are thin and difficult to handle, down to 50µm. - Custom designs tailored to specific objects, such as square shapes, are also available. For more details, please contact us or download the catalog.
- Company：大日商事
- Price：Other
